When AI Meets Compound Semiconductors: An Energy Revolution Poised to Reshape a Trillion-Dollar Market
业界动态 Industry
英飞凌追投500亿元,拟建全球最大200mm
功率半导体工厂
Infineon is set to invest an additional 50 billion yuan to build the world's largest 200 mm silicon-carbide power semiconductor fab.
安世半导体宣布推出用于AI服务器的SiC二极管
Nexperia announces SiC diodes for AI servers.
天岳先进开启招股,拟募资约18亿扩张大尺寸SiC衬底产能
SICC has launched its IPO, aiming to raise approximately RMB 1.8 billion to expand large-diameter SiC substrate capacity
JX拟将InP衬底的产能提高20%
JX to boost InP substrate production capacity by 20%.
MACOM完成三角研究园GaN-on-SiC晶圆厂的接管
MACOM completes transfer of Research Triangle Park GaN-on-SiC fab.
技术 Technology
AlScN压电微机电系统共性工艺技术开发
Development of Generic Process Technology for AlScN Piezoelectric MEMS
将
(SiC)送入太空
Launching SiC into space
最新突破:
纤锌矿铁电体低场驱动的畴壁运动
Breakthrough in Promoting Low-Field-Driven Domain Wall Motion in Wurtzite Ferroelectrics
Wolfspeed:
重组焕发生机?
Wolfspeed: Rejuvenated by restructuring?
科技前沿 Research Review
用于 Ga2O3晶体管的硅基氮化镓
A GaN-on-silicon foundation for Ga2O3 transistors
用全包围金刚石冷却的射频氮化镓高电子迁移率晶体管
Cooling RF GaN HEMTs with all-around diamond
武大、西电联合攻关在跨材料、跨功能的宽禁带半导体异构集成 领域取得突破性进展
Wuhan and Xidian University have made groundbreaking progress in the field of heterogeneous integration of wide bandgap semiconductors with integration material and functional properties
Evatec专栏 Evatec Column
混合式 DBR——单一工艺变革为Micro LED 生产带来双重效益
Hybrid DBR: A Single-Process Innovation Delivers Dual Benefits for Micro LED Manufacturing
尽管CMOS与硅集成电路(IC)的制造密切相关,但这一灵活的工艺也可以应用于采用 制造光子和微波电路。